SPM系列抛光机*APPARATUSTOPOLISHILICONWAFERSPLACEDONTHEBASEPLATEACCURATELYANDEFFICIENTLY*Perfectforsuper-accurateandefficientpolishingof wafers.*Turntablespeedissteplesslychangeableintherangeof0-50rpmwiththedialandthankstoitscushion-startdevicewaferscanbepolishedwithoutbeingdamaged.*Asthepolishingloadisappliedbythedeadweight,theloadsonthefourshaftsdonotchange.(5%orless)*Asthebaseplatecanbeputinoroutfromframeofthemachine,anoperatorsworkingspaceandthemachineinstallationspacecanbesmall.*Thebaseplatecanbeautomaticallytakenoutbyemployingaconveyerarm.Itisreadyforthefutureautomaticprocessinglines. 设备概要:本设备为半导体晶片用单面抛光机。使用机械与化学的结合方式对晶片进行高精度抛光。可对应各种半导体材料(包括硅,锗,砷化镓等)对应工件尺寸: 4 ,5 ,6 晶片。 1．抛光加压方式 重块方式(带有中心部气缸加压) 2．加工压力 总压力=抛光头本身重量(材质SUS304)+重块重量(材质SUS304) 重块罩(SUS304,特氟隆表面处理)+PVC(每轴)