品名手机主板类型八层二阶（1+1+4+1+1）埋/盲孔/化金/阻抗板结构T1.0mmFR4+RCC1/0.5/0.5/0.5/0.5/0.5/0.5/1OZ最小基板厚0.15mm阻抗L1层单线阻抗W=4mil60Ω+/-10％L3层单线阻抗W=4mil60Ω+/-10％单线阻抗W=10mil45Ω+/-10％L8层单线阻抗W=4mil60Ω+/-10％其它L1-L8层通孔最小成品8milL3-L4，L2-L7层埋孔最小成品8milL1-L2，L2-L3，L8-L7，L6-L5二阶层盲孔6mil激光打孔4mil成品孔径最小线宽/线距W=4milS=4mil外型公差+/-0.1mm