品名手机主板类型八层二阶（2+4+2）埋/盲孔/化金/阻抗板结构T1.2mmFR4+RCC1/1/1/1/1/1/1/1OZ最小基板厚0.15mm阻抗L1层单线阻抗W=4mil60Ω+/-10％L3层单线阻抗W=4mil60Ω+/-10％L6层单线阻抗W=4mil60Ω+/-10％L8层单线阻抗W=4mil60Ω+/-10％其它L1-L8层通孔最小成品10milL1-L3，L8-L6层二阶盲孔5mil激光打孔3mil成品孔径最小线宽/线距W=4milS=4milAu≥0.025umNi≥3.0um外型公差+/-0.1mm