PRODUCTTYPE产品类型■高频印制板（ＨＦＰＣＢ）适用微波传输电子产品HighfrequencyPCB(HFPCB)suitableforelectricproductswithmicrowavetransmission■单面印制板（SPCB）基材FR4Single-sidedPCB(SPCB)withbasematerialofFR4■双面印制板（SPCB）基材FR4Double-sidedPCB(DPCB)withbasematerialofFR4■多层印制板(MPCB)基材FR4、PPMulti-layerPCB(MPCB)withbasematerialofFR4andPP■高密度印制板（HDIPCB）含埋/盲孔，适用BGA电子产品High-densityPCB(HDIPCB)includingbuilt-in/blindholes，whichissuitableforBGAelectricproducts■铝基印制板适用大功率散热电子产品AluminumbasePCBsuitableforelectricproductswithhighpowerheatdissipationCAPABILITY制作能力■产品类型（ProductType）单面板/双面板/多层板3-12层（Singleside/doubleside/mutilayer3-12layers）■常用基材（BaseMaterial）高频板材（HFBaseMaterial）FR-4、CEM-3铝基板材（Albasicmaterial）陶瓷板材（Ceramicbasicmaterial）■板厚度（BoardThickness）内层芯片0.15-1.50mm（Innercore）总厚度0.20-3.50mm（TotalThickness）■板厚公差（ToleranceofBoardThickness）内层芯最大公差±0.08mm（InnerCoreThickness）总厚度公差±0.15mm（Toleranceoftotalboardthickness）■铜箔厚17-175μm（CopperFoilThickness）■最大加工面积800×500mm（Max.UnitArea）■最小产品面积2×10mm（Min.UnitArea）■最小孔径0.3mm/12mil（Min.HoleSize）■最小线宽0.127mm/5mil（Min.LineWidth）■最小间距0.127mm/5mil（Min.Space）■阻焊油墨（Tamura）Dsr-2200（NANIA）LP-3G（SolderMask）■外形加工精度0.15mm（PrecisionofOutling）■表面处理（SurfaceTreatment）喷锡（SloderCoating）（Gold.NickelPlating）（ElectronessAu）沉金（Cobalt/GoldPlating，HardGold）镀钴/金（硬金）（OSPCoating）OSP涂膜■内层对位公差±0.10mm（ToleranceoflnnerAqaistOuterlayer）■生产能力6000M2/月（month），200M2/日（day）（ProductingCapacity）■交货周期样品2-3天批量5-8天Thecompanyiscommittedtothesupplyofsampleswithin2-3daysandmassproductionproductswithin5-8daiys.