特征和产品说明:FeaturesandDescriptions:●标准直径3mm封装 Standarddiameter3mmpackage ●长寿命和高可靠性 Longlifeandhighreliability ●集成电路 I.C.compatible●芯片材料:铝镓铟磷 Chipmaterial:AlGaInP?●低功耗 LowPower●符合ROHS,无铅 RoHSCompliant,nolead备注:Notes:●所有尺寸均为毫米(英寸)。Alldimensionsareinmillimeters(inches).● 胶体底部树脂凸出最大不超过1.5mm。Themaximumbulgeofresinatthebottomdoesn texceed1.5mm.● 尺寸公差Toleranceis 0.25