QJ101银焊粉（用纯净水调成糊状后涂于焊口表面,或先将钎料加热后粘着焊粉）配合银基、铜基钎料在550-850℃钎焊铜及铜合金、不锈钢、硬质合金、高温合金等多种材料。比一般银钎剂渗透性强、慢流性优、性能稳定、使用方便。 QJ102银焊粉在650-850℃范围内配合银焊料钎焊铜及铜合金、钢和不锈钢，能够有效的保护焊材不被氧化，促进钎料的流动。本品粉末细，漫流性好，是理想的银焊剂。QJ101silversolderpowder(withpurewaterafterthetransferintoapasteappliedtothesurfaceofWeldedJoints,orfirstheatedsolderadhesionsolderpowder)withthesilver-based,copper-basedsolderinthe550-850℃brazingcopperandcopperalloys,stainlesssteel,cementedcarbide,hightemperaturealloysandothermaterials.Fluxthantheaveragepermeabilityofsilver,andtheslowflowofsuperior,stableperformanceandeasytouse.QJ102intherangeof650-850℃withsilversolderbrazingcopperandcopperalloy,steelandstainlesssteel,weldingconsumableseffectiveprotectioncannotbeoxidized,andpromotetheflowofsolder.Thisproductisfinepowder,floodingisgood,isanidealsilverflux.